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SC138 UPC1679G SMDJ90CA 58200 UPC1679G LTC21 605D11 R1004
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  cal-chip e l e c t r o n i c s , i n c o r p o r a t e d multilayer ceramic chip capacitors intr oduction multilayer surface mount ceramic capacitors are constructed by screen printing alternative layers of internal metallic electrodes onto ceramic dielectric materials and firing into a concrete monolithic body, then completed by application of metal end terminations which are fired to assure permanent bonding with the individual internal electrodes. multilayer ceramic capacitors have various features such as large capacitance values in small sizes and excellent high frequency characteristics. moreover, chip capacitors can be used on surface mount assembly equipment. our fully integrated manufacturing and total quality control systems ensure unprecedented high standards of quality and reliability. chip capacitor selection selection of the most suitable capacitor for any application is based on the following: dielectric type the choice of dielectric is largely determined by the temperature stability required. cog (npo) capacitance change with temperature is 0-30ppm/c which is less than -0.3%c from -55c to +125c. typical capacitance change with life is less than -0.1% for npos, one-fifth that shown by most other dielectrics. npo formulations show no aging characteristics. x7r /x5r its temperature variation of capacitance is within 15% from -55c to +125c (-55c to +85c for x5r). the capacitance change is z5u despite their capacitance instability, z5u formulations are very popular because of their small size, temperature range low esl, low esr and e xcellent frequency response. these features are particularly important for decoupling application where only a minimum capacitance value is required. y5v y5v formulations are for general purpose use in a limited temperature range. they have a wide temperature characteristic of +22% - 82% capacitance change over the operating temperature range of -30c to +85c. y5vs high dielectric constant allows the manufacture of very high capacitance values (up to 22mf) in small physical sizes. capacitance value & tolerance determined by circuit requirements. note that chip prices decrease with lower capacitance value and looser tolerance. voltage determined by circuit requirements. units are designed to exceed the withstanding voltage specification, i.e., the user need not incorporate an additional safety margin. capacitor size select the smallest unit permitted by the circuit constraints that provides the required capacitance and voltage rating. all cal-chip capacitors conform to eia specifications. capacitor termination nic k el barr ier is standard and recommended f or units e xposed to repeated solder cycles , to minimiz e leaching of the ter- mination. gmc s eries non-linear.
capacitance values are represented in 3 digits, and expressed in pf. the first two digits are significant, and the third is the number of zeros. the letter r is used as a decimal point. 0.5pf 5pf 10pf 100pf 1000pf .01mf .1mf 1.0mf 10mf 0r5 5r0 100 101 102 103 104 105 106 t cg (cog) (npo) x7r or x5r z5u y5v cal-chip e l e c t r o n i c s , i n c o r p o r a t e d multilayer ceramic chip capacitors gmc21 cg 102 j 50 n tm size code dielectric capacitance (pf) capacitance tolerance (eia code) voltage termination packaging code b c d f g j k m z 6r3 10 16 25 50 100 200 n nickel barrier tape and reel construction example inner electrodes solder plate; 100% matte sn ; typical thic kness 0.003mm to 0.005mm *(please see note) el ae ae ( ones letoplate el n) 0.1pf for 10pf 0.25pf for 10pf 0.5pf for 10pf 1% 2% 5% 10% 20% -20%~+80% 6.3 dc 10 dc 16 dc 25 dc 50 dc 100 dc 200 dc < < <
multilayer ceramic chip capacitors 0201 dimension (mm) gmc02 l 0.6 r 0.03 w 0.3 r 0.03 h 0.3 r 0.03 bw 0.15 r 0.05 dielectric npo/cog x5r x7r y5v/z5u rated voltage 25 6.3 10 6.3 10 16 6.3 ca p . ran g e 0.5p f 0r5 1.0 1r0 1.2 1r2 1.5 1r5 1.8 1r8 2.2 2r2 2.7 2r7 3.3 3r3 3.9 3r9 4.7 4r7 5.6 5r6 6.8 6r8 8.2 8r2 10 100 12 120 15 150 18 180 22 220 27 270 33 330 39 390 47 470 56 560 68 680 82 820 100 101 120 121 150 151 180 181 220 221 270 271 330 331 390 391 470 471 560 561 680 681 820 821 1.0nf 102 1.2 122 1.5 152 1.8 182 2.2 222 2.7 272 3.3 332 3.9 392 4.7 472 5.6 562 6.8 682 8.2 822 10 103 12 123 15 153 18 183 22 223 27 273 33 333 39 393 47 473 56 563 68 683 82 823 100 104 120 124 150 154 180 184 22 0 224 270 274 330 334 390 394 470 474 560 564 680 684 820 824 1.0uf 105 2.2 225
multilayer ceramic chip capacitors 0402 & 0603 gmc04 gmc10 type 0402 0603 length (l1) mm inches 1.0 r 0.05 0.04 r 0.002 1.6 r 0.2 0.063 r 0.008 width (w) mm inches 0.5 r 0.05 0.02 r 0.002 0.8 r 0.2 0.031 r 0.008 thickness (h) mm inches 0.5 r 0.1 0.02 r 0.004 0.8 r 0.2 0.031 r 0.008 termination band (l2+l3) mm inches min 0.1 0.004 max 0.35 0.014 min 0.1 0.004 max 0.4 0.015 band gap (l4)mm (min) inches 0.3 0.012 0.6 0.015 dielectric cog x5r x7r y5v & z5u cog x5r x7r y5v & z5u rated voltage d.c. 25 50 6.3 10 16 6.3 10 16 25 50 6.3 10 16 25 50 25 50 100 6.3 10 16 6.3 10 16 25 50/ 100 6.3 10 16 25 50 cap range code 0.5pf 0r5 1.0 1r0 1.2 1r2 1.5 1r5 1.8 1r8 2.2 2r2 2.7 2r7 3.3 3r3 3.9 3r9 4.7 4r7 5.6 5r6 6.8 6r8 8.2 8r2 10 100 12 120 15 150 18 180 22 220 27 270 33 330 39 390 47 470 56 560 68 680 82 820 100 101 120 121 150 151 180 181 220 221 270 271 330 331 390 391 470 471 560 561 680 681 820 821 1.0nf 102 1.2 122 1.5 152 1.8 182 2.2 222 2.7 272 3.3 332 3.9 392 4.7 472 5.6 562 6.8 682 8.2 822 10 103 12 123 15 153 18 183 22 223 27 273 33 333 39 393 47 473 56 563 68 683 82 823 100 104 150 154 220 224 270 274 330 334 390 394 470 474 560 564 680 684 820 824 1.0uf 105 2.2 225 2.7 275 3.3 335 3.9 395 4.7 475 5.6 565 6.8 685 8.2 825 10 106 15 156 22 226 33 336 47 476
multilayer ceramic chip capacitors cog/npo gmc21 gmc31 gmc32 gmc40 gmc43 gmc45 gmc55 gmc57 type 0805 1206 1210 1808 1812 1825 2220 2225 length mm inches 2.0 r 0.3 0.08 r 0.012 3.2 r 0.3 0.125 r 0.012 3.2 r 0.3 0.125 r 0.012 4.57 r 0.25 0.18 r 0.01 4.5 r 0.35 0.18 r 0.014 4.5 r 0.35 0.18 r 0.014 5.7 r 0.4 0.225 r 0.016 5.7 r 0.4 0.225 r 0.016 width mm inches 1.25 r 0.2 0.05 r 0.008 1.6 r 0.2 0.063 r 0.008 2.5 r 0.3 0.10 r 0.012 2.03 r 0.25 0.08 r 0.01 3.2 r 0.3 0.125 r 0.012 6.3 r 0.4 0.25 r 0.016 5.0 r 0.4 0.197 r 0.016 6.3 r 0.4 0.25 r 0.016 thick (max) mm inches 1.3 0.051 1.6 0.063 1.8 0.07 2.03 0.08 1.8 0.07 1.8 0.07 1.8 0.07 1.8 0.07 termination band mm inches min 0.25 0.01 max 0.75 0.03 min 0.25 0.01 max 0.75 0.03 min 0.25 0.01 max 0.75 0.03 min 0.25 0.01 max 0.75 0.03 min 0.25 0.01 max 0.75 0.03 min 0.25 0.01 max 0.75 0.03 min 0.25 0.01 max 0.75 0.03 min 0.25 0.01 max 0.75 0.03 band gap mm inches 0.5 0.019 1.4 0.055 1.4 0.055 2.0 0.078 2.2 0.087 2.2 0.087 2.9 0.114 2.9 0.114 rated voltage d.c. 16 25 50 25 50 16 25 50/63 50/63 50/63 50/63 50/63 50/63 cap. range code 0.5pf 0r5 1.0 1r0 1.2 1r2 1.5 1r5 1.8 1r8 2.2 2r2 2.7 2r7 3.3 3r3 3.9 3r9 4.7 4r7 5.6 5r6 6.8 6r8 8.0 8r0 10 100 12 120 15 150 18 180 22 220 27 270 33 330 39 390 47 470 56 560 68 680 82 820 100 101 120 121 150 151 180 181 220 221 270 271 330 331 390 391 470 471 560 561 680 681 820 821 1.0nf 102 1.2 122 1.5 152 1.8 182 2.2 222 2.7 272 3.3 332 3.9 392 4.7 472 5.6 562 6.8 682 8.2 822 10 103 12 123 15 153 18 183 22 223 27 273 33 333 39 393 47 473 56 563 68 683 82 823 100 104 120 124 150 154 180 184 220 224 270 274 330 334 390 394 470 474 560 564 680 684 820 824 1.0uf 105 2.2 225 3.3 335 4.7 475 6.8 685 10 106 22 226 33 336 47 476 100 107
multilayer ceramic chip capacitors cog/npo (cont.) gmc21 gmc31 gmc32 gmc40 gmc43 gmc45 gmc55 gmc57 type 0805 1206 1210 1808 1812 1825 2220 2225 length mm inches 2.0 0.3 0.08 0.012 3.2 0.3 0.125 0.012 3.2 0.3 0.125 0.012 4.57 0.25 0.18 0.01 4.5 0.35 0.18 0.014 4.5 0.35 0.18 0.014 5.7 0.4 0.225 0.016 5.7 0.4 0.225 0.016 width mm inches 1.25 0.2 0.05 0.008 1.6 0.2 0.063 0.008 2.5 0.3 0.10 0.012 2.03 0.25 0.08 0.01 3.2 0.3 0.125 0.012 6.3 0.4 0.25 0.016 5.0 0.4 0.197 0.016 6.3 0.4 0.25 0.016 thick (max) mm inches 1.3 0.051 1.6 0.063 1.8 0.07 2.03 0.08 1.8 0.07 1.8 0.07 1.8 0.07 1.8 0.07 termination band mm inches min 0.25 0.01 max 0.75 0.03 min 0.25 0.01 max 0.75 0.03 min 0.25 0.01 max 0.75 0.03 min 0.25 0.01 max 0.75 0.03 min 0.25 0.01 max 0.75 0.03 min 0.25 0.01 max 0.75 0.03 min 0.25 0.01 max 0.75 0.03 min 0.25 0.01 max 0.75 0.03 band gap mm inches 0.5 0.019 1.4 0.055 1.4 0.055 2.0 0.078 2.2 0.087 2.2 0.087 2.9 0.114 2.9 0.114 rated voltage d.c. 100 200 100 200 100 200 100 200 100 200 100 200 100 200 100 200 cap. range code 0.5pf 0r5 1.0 1r0 1.2 1r2 1.5 1r5 1.8 1r8 2.2 2r2 2.7 2r7 3.3 3r3 3.9 3r9 4.7 4r7 5.6 5r6 6.8 6r8 8.2 8r2 10 100 12 120 15 150 18 180 22 220 27 270 33 330 39 390 47 470 56 560 68 680 82 820 100 101 120 121 150 151 180 181 220 221 270 271 330 331 390 391 470 471 560 561 680 681 820 821 1.0nf 102 1.2 122 1.5 152 1.8 182 2.2 222 2.7 272 3.3 332 3.9 392 4.7 472 5.6 562 6.8 682 8.2 822 10 103 12 123 15 153 18 183 22 223 27 273 33 333 39 393 47 473 56 563 68 683 82 823 100 104 120 124 150 154 180 184 220 224 270 274 330 334 390 394 470 474 560 564 680 684 820 824 1.0uf 105 2.2 225 3.3 335 4.7 475 6.8 685 10 106 22 226 33 336 47 476 68 686 100 107
multilayer ceramic chip capacitors x7r gmc21 gmc31 gmc32 gmc40 gmc43 gmc45 gmc55 gmc57 type 0805 1206 1210 1808 1812 1825 2220 2225 length mm inches 2.0 r 0.3 0.08 r 0.012 3.2 r 0.3 0.125 r 0.012 3.2 r 0.3 0.125 r 0.012 4.57 r 0.25 0.18 r 0.01 4.5 r 0.35 0.18 r 0.014 4.5 r 0.35 0.18 r 0.014 5.7 r 0.4 0.225 r 0.016 5.7 r 0.4 0.225 r 0.016 width mm inches 1.25 r 0.2 0.05 r 0.008 1.6 r 0.2 0.063 r 0.008 2.5 r 0.3 0.10 r 0.012 2.03 r 0.25 0.08 r 0.01 3.2 r 0.3 0.125 r 0.012 6.3 r 0.4 0.25 r 0.016 5.0 r 0.4 0.197 r 0.016 6.3 r 0.4 0.25 r 0.016 thick (max) mm inches 1.5 0.059 1.8 0.071 2.8 0.110 3.0 0.118 3.0 0.118 3.2 0.126 3.5 0.138 3.5 0.138 termination band mm inches min 0.25 0.01 max 0.75 0.03 min 0.25 0.01 max 0.75 0.03 min 0.25 0.01 max 0.75 0.03 min 0.25 0.01 max 0.75 0.03 min 0.25 0.01 max 0.75 0.03 min 0.25 0.01 max 0.75 0.03 min 0.25 0.01 max 0.75 0.03 min 0.25 0.01 max 0.75 0.03 band gap mm inches 0.5 0.019 1.4 0.055 1.4 0.055 2.0 0.078 2.2 0.087 2.2 0.087 2.9 0.114 2.9 0.114 rated voltage d.c. 6.3 10 16 25 6.3 10 16 25 10 16 25 10 16 25 10 16 25 10 16 25 10 16 25 10 16 25 cap. range code 0.5pf 0r5 1.0 1r0 1.2 1r2 1.5 1r5 1.8 1r8 2.2 2r2 2.7 2r7 3.3 3r3 3.9 3r9 4.7 4r7 5.6 5r6 6.8 6r8 8.2 8r2 10 100 12 120 15 150 18 180 22 220 27 270 33 330 39 390 47 470 56 560 68 680 82 820 100 101 120 121 150 151 180 181 220 221 270 271 330 331 390 391 470 471 560 561 680 681 820 821 1.0nf 102 1.2 122 1.5 152 1.8 182 2.2 222 2.7 272 3.3 332 3.9 392 4.7 472 5.6 562 6.8 682 8.2 822 10 103 12 123 15 153 18 183 22 223 27 273 33 333 39 393 47 473 56 563 68 683 82 823 100 104 120 124 150 154 180 184 220 224 270 274 330 334 390 394 470 474 560 564 680 684 820 824 1.0uf 105 2.2 225 3.3 335 4.7 475 6.8 685 10 106 22 226 33 336 47 476 68 686 100 107
multilayer ceramic chip capacitors x7r (cont) gmc21 gmc31 gmc32 gmc40 gmc43 gmc45 gmc55 gmc57 type 0805 1206 1210 1808 1812 1825 2220 2225 length mm inches 2.0 0.3 0.08 0.012 3.2 0.3 0.125 0.012 3.2 0.3 0.125 0.012 4.57 0.25 0.18 0.01 4.5 0.35 0.18 0.014 4.5 0.35 0.18 0.014 5.7 0.4 0.225 0.016 5.7 0.4 0.225 0.016 width mm inches 1.25 0.2 0.05 0.008 1.6 0.2 0.063 0.008 2.5 0.3 0.10 0.012 2.03 0.25 0.08 0.01 3.2 0.3 0.125 0.012 6.3 0.4 0.25 0.016 5.0 0.4 0.197 0.016 6.3 0.4 0.25 0.016 thick (max) mm inches 1.3 0.051 1.6 0.063 1.8 0.07 2.03 0.08 1.8 0.07 1.8 0.07 1.8 0.07 1.8 0.07 termination band mm inches min 0.25 0.01 max 0.75 0.03 min 0.25 0.01 max 0.75 0.03 min 0.25 0.01 max 0.75 0.03 min 0.25 0.01 max 0.75 0.03 min 0.25 0.01 max 0.75 0.03 min 0.25 0.01 max 0.75 0.03 min 0.25 0.01 max 0.75 0.03 min 0.25 0.01 max 0.75 0.03 band gap mm inches 0.5 0.019 1.4 0.055 1.4 0.055 2.0 0.078 2.2 0.087 2.2 0.087 2.9 0.114 2.9 0.114 rated voltage d.c. 50 100 200 50 100 200 50 100 200 50 100 200 50 100 200 50 100 200 50 100 200 50 100 200 cap. range code 0.5pf 0r5 1.0 1r0 1.2 1r2 1.5 1r5 1.8 1r8 2.2 2r2 2.7 2r7 3.3 3r3 3.9 3r9 4.7 4r7 5.6 5r6 6.8 6r8 8.2 8r2 10 100 12 120 15 150 18 180 22 220 27 270 33 330 39 390 47 470 56 560 68 680 82 820 100 101 120 121 150 151 180 181 220 221 270 271 330 331 390 391 470 471 560 561 680 681 820 821 1.0nf 102 1.2 122 1.5 152 1.8 182 2.2 222 2.7 272 3.3 332 3.9 392 4.7 472 5.6 562 6.8 682 8.2 822 10 103 12 123 15 153 18 183 22 223 27 273 33 333 39 393 47 473 56 563 68 683 82 823 100 104 120 124 150 154 180 184 220 224 270 274 330 334 390 394 470 474 560 564 680 684 820 824 1.0uf 105 2.2 225 3.3 335 4.7 475 6.8 685 10 106 22 226
multilayer ceramic chip capacitors x5r gmc21 gmc31 gmc32 gmc40 gmc43 gmc45 gmc55 gmc57 type 0805 1206 1210 1808 1812 1825 2220 2225 length mm inches 2.0 0.3 0.08 0.012 3.2 0.3 0.125 0.012 3.2 0.3 0.125 0.012 4.57 0.25 0.18 0.01 4.5 0.35 0.18 0.014 4.5 0.35 0.18 0.014 5.7 0.4 0.225 0.016 5.7 0.4 0.225 0.016 width mm inches 1.25 0.2 0.05 0.008 1.6 0.2 0.063 0.008 2.5 0.3 0.10 0.012 2.03 0.25 0.08 0.01 3.2 0.3 0.125 0.012 6.3 0.4 0.25 0.016 5.0 0.4 0.197 0.016 6.3 0.4 0.25 0.016 thick (max) mm inches 1.5 0.059 1.8 0.070 2.8 0.110 3.0 0.118 3.0 0.118 3.2 0.126 3.5 0.138 3.5 0.138 termination band mm inches min 0.25 0.01 max 0.75 0.03 min 0.25 0.01 max 0.75 0.03 min 0.25 0.01 max 0.75 0.03 min 0.25 0.01 max 0.75 0.03 min 0.25 0.01 max 0.75 0.03 min 0.25 0.01 max 0.75 0.03 min 0.25 0.01 max 0.75 0.03 min 0.25 0.01 max 0.75 0.03 band gap mm inches 0.5 0.019 1.4 0.055 1.4 0.055 2.0 0.078 2.2 0.087 2.2 0.087 2.9 0.114 2.9 0.114 rated voltage d.c. 6.3 10 16 6.3 10 16 25 6.3 10/16 25 n/a 6.3 10 16 6.3 10 16 6.310/1625 16 25 cap. range code 0.5pf 0r5 1.0 1r0 1.2 1r2 1.5 1r5 1.8 1r8 2.2 2r2 2.7 2r7 3.3 3r3 3.9 3r9 4.7 4r7 5.6 5r6 6.8 6r8 8.2 8r2 10 100 12 120 15 150 18 180 22 220 27 270 33 330 39 390 47 470 56 560 68 680 82 820 100 101 120 121 150 151 180 181 220 221 270 271 330 331 390 391 470 471 560 561 680 681 820 821 1.0nf 102 1.2 122 1.5 152 1.8 182 2.2 222 2.7 272 3.3 332 3.9 392 4.7 472 5.6 562 6.8 682 8.2 822 10 103 12 123 15 153 18 183 22 223 27 273 33 333 39 393 47 473 56 563 68 683 82 823 100 104 120 124 150 154 180 184 220 224 270 274 330 334 390 394 470 474 560 564 680 684 820 824 1.0uf 105 2.2 225 3.3 335 4.7 475 6.8 685 10 106 22 226 33 336 47 476 100 107
multilayer ceramic chip capacitors y5v/z5u gmc21 gmc31 gmc32 gmc40 gmc43 gmc45 gmc55 gmc57 type 0805 1206 1210 1808 1812 1825 2220 2225 length mm inches 2.0 r 0.3 0.08 r 0.012 3.2 r 0.3 0.125 r 0.012 3.2 r 0.3 0.125 r 0.012 4.57 r 0.25 0.18 r 0.01 4.5 r 0.35 0.18 r 0.014 4.5 r 0.35 0.18 r 0.014 5.7 r 0.4 0.225 r 0.016 5.7 r 0.4 0.225 r 0.016 width mm inches 1.25 r 0.2 0.05 r 0.008 1.6 r 0.2 0.063 r 0.008 2.5 r 0.3 0.10 r 0.012 2.03 r 0.25 0.08 r 0.01 3.2 r 0.3 0.125 r 0.012 6.3 r 0.4 0.25 r 0.016 5.0 r 0.4 0.197 r 0.016 6.3 r 0.4 0.25 r 0.016 thick (max) mm inches 1.5 0.059 1.8 0.07 2.8 0.110 3.0 0.118 3.0 0.118 3.2 0.126 3.5 0.138 3.5 0.138 termination band mm inches min 0.25 0.01 max 0.75 0.03 min 0.25 0.01 max 0.75 0.03 min 0.25 0.01 max 0.75 0.03 min 0.25 0.01 max 0.75 0.03 min 0.25 0.01 max 0.75 0.03 min 0.25 0.01 max 0.75 0.03 min 0.25 0.01 max 0.75 0.03 min 0.25 0.01 max 0.75 0.03 band gap mm inches 0.5 0.019 1.4 0.055 1.4 0.055 2.0 0.078 2.2 0.087 2.2 0.087 2.9 0.114 2.9 0.114 rated voltage d.c. 6.3 10 16 25 6.3 10 16 25/35 6.3 10 16 25/3 5 6 .3 10 16 25 6.3 10 16 25/35 6.3 10 16 25 6.3 10 16 25 6.3 10 16 25 cap. range code 0.5pf 0r5 1.0 1r0 1.2 1r2 1.5 1r5 1.8 1r8 2.2 2r2 2.7 2r7 3.3 3r3 3.9 3r9 4.7 4r7 5.6 5r6 6.8 6r8 8.2 8r2 10 100 12 120 15 150 18 180 22 220 27 270 33 330 39 390 47 470 56 560 68 680 82 820 100 101 120 121 150 151 180 181 220 221 270 271 330 331 390 391 470 471 560 561 680 681 820 821 1.0nf 102 1.2 122 1.5 152 1.8 182 2.2 222 2.7 272 3.3 332 3.9 392 4.7 472 5.6 562 6.8 682 8.2 822 10 103 12 123 15 153 18 183 22 223 27 273 33 333 39 393 47 473 56 563 68 683 82 823 100 104 120 124 150 154 180 184 220 224 270 274 330 334 390 394 470 474 560 564 680 684 820 824 1.0uf 105 2.2 225 3.3 335 4.7 475 6.8 685 10 106 22 226 33 336 47 476 68 686 100 107
multilayer ceramic chip capacitors y5v/z5u (cont) gmc21 gmc31 gmc32 gmc40 gmc43 gmc45 gmc55 gmc57 type 0805 1206 1210 1808 1812 1825 2220 2225 length mm inches 2.0 0.3 0.08 0.012 3.2 0.3 0.125 0.012 3.2 0.3 0.125 0.012 4.57 0.25 0.18 0.01 4.5 0.35 0.18 0.014 4.5 0.35 0.18 0.014 5.7 0.4 0.225 0.016 5.7 0.4 0.225 0.016 width mm inches 1.25 0.2 0.05 0.008 1.6 0.2 0.063 0.008 2.5 0.3 0.10 0.012 2.03 0.25 0.08 0.01 3.2 0.3 0.125 0.012 6.3 0.4 0.25 0.016 5.0 0.4 0.197 0.016 6.3 0.4 0.25 0.016 thick (max) mm inches 1.5 0.059 1.8 0.07 2.8 0.110 3.0 0.118 3.0 0.118 3.2 0.126 3.5 0.138 3.5 0.138 termination band mm inches min 0.25 0.01 max 0.75 0.03 min 0.25 0.01 max 0.75 0.03 min 0.25 0.01 max 0.75 0.03 min 0.25 0.01 max 0.75 0.03 min 0.25 0.01 max 0.75 0.03 min 0.25 0.01 max 0.75 0.03 min 0.25 0.01 max 0.75 0.03 min 0.25 0.01 max 0.75 0.03 band gap mm inches 0.5 0.019 1.4 0.055 1.4 0.055 2.0 0.078 2.2 0.087 2.2 0.087 2.9 0.114 2.9 0.114 rated voltage d.c. 50 100 200 50 100 200 50 100 200 50 100 200 50 100 200 50 100 200 50 100 200 50 100 200 cap. range code 0.5pf 0r5 1.0 1r0 1.2 1r2 1.5 1r5 1.8 1r8 2.2 2r2 2.7 2r7 3.3 3r3 3.9 3r9 4.7 4r7 5.6 5r6 6.8 6r8 8.2 8r2 10 100 12 120 15 150 18 180 22 220 27 270 33 330 39 390 47 470 56 560 68 680 82 820 100 101 120 121 150 151 180 181 220 221 270 271 330 331 390 391 470 471 560 561 680 681 820 821 1.0nf 102 1.2 122 1.5 152 1.8 182 2.2 222 2.7 272 3.3 332 3.9 392 4.7 472 5.6 562 6.8 682 8.2 822 10 103 12 123 15 153 18 183 22 223 27 273 33 333 39 393 47 473 56 563 68 683 82 823 100 104 120 124 150 154 180 184 220 224 270 274 330 334 390 394 470 474 560 564 680 684 820 824 1.0uf 105 2.2 225 3.3 335 4.7 475 6.8 685 10 106 22 226 33 336 47 476 68 686 100 107
1 2 operating temperature range temperature coefficient temperature voltage coefficient ( ? cmax @ v dcw ) dissipation factor insulation resistance dielectric withstanding voltage aging rate test parameters operating temperature range temperature coefficient temperature voltage coefficient ( ? cmax @ v dcw ) dissipation factor insulation resistance dielectric withstanding voltage aging rate test parameters cog dielectric ultra stable class i dielectric: linear temperature coefficient, low loss, negligible change of electrical properties with time, voltage and frequency. cal-chip e l e c t r o n i c s , i n c o r p o r a t e d multilayer ceramic chip capacitors -55c to +125c 030ppmc 030ppm/c 0.1% max, 0.02% typical ? 25c, v dcw:: >100g ? f or 1000 ? f, whichever is less ?125c, v dcw: >10g ? f or 100 ? f whichever is less 3 x v dcw 0% per decade hour ? c 1000pf f=1mhz v=1.0vrms 0.2vrms t=25c ? c>1000pf f=1khz v=1.0vrms 0.2vrms t=25c x7r dielectric stable class ii dielectric (eia x7r) -55c to +125c 15% x7r not applicable 2.5% max, 1.8% typical ? 25c, v dcw:: >100g ? for 1000 ? f, whichever is less ?125c, v dcw: >10g ? f or 100 ? f whichever is less 2.5 x v dcw <2% per decade hour 1khz, 1.0vrms 0.2vrms 25c gmc s eries values > or = to 10uf 1.0vrms 120hz
1 3 operating temperature range temperature coefficient dissipation factor insulation resistance dielectric withstanding voltage aging rate test parameters abcdewt r abcdewt r -30c to +85c +22% -82% 3.0% max, 2.0% typical 10g ? or 100 ? f whichever is less, 25c, v dcw 2.5 x v dcw 3.0% per decade hour 1khz, 1vrms 25c high capacitance per unit volume: general purpose product p ac ka ging (t aping) cal-chip e l e c t r o n i c s , i n c o r p o r a t e d multilayer ceramic chip capacitors - z5u (y5v) dielectric ?178 2.0 ?50 min. ?13.0 0.5 ?21.0 0.8 2.0 0.5 14.9 1.5 0.8 0.2 1.0 standard reel unit:mm ?250 2.0 ?50 min. ?13.0 0.5 ?21.0 0.8 2.0 0.5 10.0 1.5 0.8 0.2 1.0 10000 units per reel optional unit:mm ? to peel off the cover tape by the method shown in the right figure apply a peel-off force of 20 gf - 60 gf (card board); 35 gf - 75 gf (plastic tape). ? the cover tape should not touch the top or bottom of the chip. ? if the cover tape has been peeled off it may be difficult to remove the chip due to punch-hole clearance, dirt, and debris. make sure therefore that no paper waste will adhere to and block the absorption nozzle. ? if the cover tape has been peeled off from the top, stick it back on with a suitable adhesive. ? follow the illustration for the start and end of the winding operation. (reel type-size) carrier tape (standard) top cover tape cover tape tension direction bottom cover tape carrier tape tape unreeling direction 165-180 { { { { start empty section empty section leader section chip mounting section 50 pitch (200mm) 30 pitch (120mm) 200mm unreeling direction gmc s eries values > or = to 10uf 1.0vrms 120hz
14 mounting hole quantity per reel type a b w f e p 1 p 2 p 0 d 0 t 1 t 2 mounting hole quantity per reel type a b w f e p 1 p 2 p 0 d 0 t 1 t 2 mounting hole quantity per reel cal-chip e l e c t r o n i c s , i n c o r p o r a t e d multilayer ceramic chip capacitors 0402 0603 0805 1206 0.70.2 1.10.2 1.650.2 2.00.2 1.30.2 1.90.2 2.40.2 3.60.2 8.00.3 3.50.05 1.750.1 2.00.05 4.00.1 2.00.05 4.00.1 ?1.5 +0.1 -0 1.1 max 1.4 max angular punch hole 10000 4000 4000 to 5000* 4000 to 5000* *dependent on chip thickness unit: mm ? cardboard carrier tape for 0402, 0603 type and 0805/1206 type 0805 1206 1210 1.450.2 2.00.2 2.90.2 2.30.2 3.60.2 3.60.2 8.00.3 3.50.05 1.750.1 4.00.1 2.00.05 4.00.1 ?1.5 +0.1 -0 0.6 max 2.5 max angular embossed hole 2000 to 5000* 2000 to 5000* 2000 to 4000* *dependent on chip thickness unit: mm ? embossed plastic carrier tape for 0805/1206 type and 1210 type type a b w f e p 1 p 2 p 0 d 0 t 1 t 2 1812 1825 2220 2225 3.60.2 6.80.3 5.50.3 6.80.3 4.90.2 4.90.2 6.20.3 6.20.3 12.00.3 5.50.05 1.750.1 8.00.1 2.00.05 4.00.1 ?1.50. 1 0.6 max. 6.5 max. angular embossed hole 1000 1000 1000 1000 *dependent on chip thickness unit: mm ? embossed plastic carrier tape for 1812, 1825, 2220 and 2225 type gmc s eries
15 item capacitance dissipation factor (tan or q) insulation resistance(ir) dielectric withstanding voltage termination adherence bend strength life test (high temperature loading test) specification within tolerance shown by part number code ? class (i) c<30pf:q 400+20xc c 30pf:q 1000 ? class (ii) x7r:df 2.5% y5v/z5u:df 3.0% npoCxr7: c 50,000pf: ir 100g ? c>50,000pf: ir 500m ? . per uf. y5v/z5u: ir 10g ? there shall be no evidence of damage or flash over during the test no mechanical damage no mechanical damage ? class (i) no more than 3% or 0.3pf whichever is less ? class (ii) x7r:10% max y5v/z5u:30% max ? class (i) c<10pf:q>200+10xc 10 c<30pf:q 275+5/2xc c 30pf:q 350 ? class (ii) x7r:df 5.0% y5v/z5u:df 7.5% 1000m ? or 50 ? f, min whichever is less test method ? class (i) c<1000pf:1mhz10%, 0.5 to 5vrms c 1000pf:1khz10%, 1.00.2vrms ? class (ii) 1khz10%, 1.00.2vrms apply rated voltage for 60 seconds at room temperature and normal humidity. (70% rh max) apply 3 x rated voltage (class i) or 2.5 x rated voltage (class ii) to both terminations for 5 seconds. charge and discharge current are less than 50ma. care shall be taken to avoid thermal shock. 500g of steady pull is applied in direction of arrow for 1 minute. after soldering capacitor on the glass-epoxy pwb, 2 mm of vend- ing shall be applied for 10 sec- onds as shown by drawing. applied 2 x rated voltage at maximum operating temperature for 1000 hours. the surge current shall not exceed 50ma after above testing condition, test sam- ples shall be kept in room temper- ature for 24 hours (class i) or 48 hours (class ii), and then shall be measured. cal-chip e l e c t r o n i c s , i n c o r p o r a t e d multilayer ceramic chip capacitors r eliability and t est conditions ? c q or df ir gmc s eries values > or = to 10uf 1.0vrms 120hz
16 item moisture test moisture resistance test temperature cycle solderability resistance to solder heat test specification ? class (i) no more than 5% or 0.5pf whichever is larger ? class (ii) x7r:10% y5v/z5u:30% ? class (i) c<10pf:q>200+10xc 10 c<30pf:q 275+5/2xc c 30pf:q 350 ? class (ii) x7r:df 5.0% y5v/z5u:df 7.5% 1000m ? or 50 ? f, whichever is less ? class (i) no more than 7.5% or 0.75pf whichever is larger ? class (ii) x7r:10% y5v/z5u:30% ? class (i) c<30pf:q>100+100/3xc c 30pf:q 200 ? class (ii) x7r:df 5.0% y5v/z5u:df 7.5% 500m ? or 25 ? f, min whichever is less ? class (i) no more than 2.5% or 0.25pf whichever is larger ? class (ii) x7r:5% y5v/z5u:20% to satisfy the specified initial value. to satisfy the specified initial value. termination area shall be at least 95% covered with a new solder coating. there shall be no crack and ceramic exposure of terminated surface by melting. ? class (i) no more than 2.5% or 0.25pf whichever is larger ? class (ii) x7r:5% y5v/z5u:20% to satisfy the specified initial value. to satisfy the specified initial value. test method the capacitors shall be subjected to 40c, 90-95%rh for 500 hours. after above testing condition, samples shall be kept in room temperature for 24 hours (class i) or 48 hours (class ii), and then shall be measur ed. apply rated voltage at 40c, 90-95%rh for 500 hours. the surge current shall not exceed 50ma. after testing with above condition, samples shall be kept in room tempera- ture for 24 hours (class i) or 48 hours (class ii), and then shall be measur ed. perform 5 cycles as follow: 1. room temperature. dwell for 15 minutes. 2. minimum operating temperature, dwell for 30 minutes. 3. room temperature, dwell for 30 minutes. 4. maximum operating temperature, dwell for 30 minutes. after above testing condition, samples shall be kept in room temperature for 24 hours (class i) or 48 hours (class ii), and then shall be measured. the capacitors are completely immersed during 40.5 seconds in the molten solder with a temperature of 2305?c *solder: sn 63. immerse into molten solder at 2705?c for 30.5 seconds. preheat before immersion. 1. 80~100?c for 2 minutes. 2. 150~180?c for 2 minutes. 3. 2705?c for 30.5 seconds. the capacitance measurement shall be made after sample keeping at room temperature for 24 hours. cal-chip e l e c t r o n i c s , i n c o r p o r a t e d multilayer ceramic chip capacitors r eliability and t est conditions ? c q or df ir ? c q or df ir ? c q or df ir ? c q or df ir gmc s eries
17 cal-chip e l e c t r o n i c s , i n c o r p o r a t e d multilayer ceramic chip capacitors a pplication m anual f or s urface m ounting 1. temperature / humidity control since dew condensation may occur by the differences in temperature when the products are take out of storage, it is important to maintain a temperature- controlled environment. 2. design of solder land pattern when designing printed circuit boards, the shape and size of the solder lands must allow for the proper amount of solder on the capacitor. the amount of solder at the end terminations has a direct effect on the probability that the chip will crack. the greater amount of solder, the larger amount of stress on the chip, and the more likely that it will break. use the following illustrations as guidelines for proper solder land design. recommendation of solder land shape and size. 3. adhesives mlccs generally require the use of an adhesive to adhere the chips to the circuit board prior to wave soldering. 3-1. requirements for adhesives - they must have enough adhesion so that the chips will not fall off or move during the handling of the circuit board. - they must maintain their adhesive strength when exposed to soldering temperatures. - they should not spread or run when applied to the circuit board. - they should have a long pot life. - they should harden quickly. - they should not corrode the circuit board or chip material. - they should be a good insulator. - they should be non-toxic, and not produce harmful gases, nor be harmful when touched. 3-2. application method it is important to use the proper amount of adhesive. too little will cause poor adhesion to the circuit board, and too much may strain the conductor pattern, thereby causing defective soldering. the following illustrations show the proper quantity of adhesive. 3-3. adhesive hardening characteristics to prevent oxidation of the terminations, the adhesive must harden at 160c or less, within 2 minutes or less. type a b c 21 0.2 min 70~100m >0 31 0.2 min 70~100m >0 (unit: mm) gmc s eries
18 4. mounting 4-1. mounting head pressure excessive pressure will cause chip capacitors to crack. the pressure between nozzle and chip capacitor will be 300g maximum during mounting. 4-2. bending stress bending of printed circuit board by mounting head when double-sided circuit boards are used, chip capacitors first are mounted and soldered onto one side of the board. when the capacitors are mounted onto the other side, it is important to support the board as shown in the illustration. if the circuit board is not supported, it may bend, causing the already installed capacitors to crack. 5. flux although highly activated flux gives better solderability, substances which increase activity may also degrade the insulation of the chip capacitors. to avoid such degradation, it is recommended that a mildly activated rosin flux (less than 0.2% chlorine) be used. 6. soldering since a multilayer chip ceramic capacitor comes into direct contact with melted solder during soldering, it is exposed to potentially damaging mechanical stress caused by the sudden temperature change. the capacitor may also be subject to silver migration, and to contamination by the flux. because of these factors, soldering technique is critical. 6-1. soldering methods 6-2. soldering profile to avoid the crack problem by sudden temperature change, follow the temperature profile in the adjacent graph. cal-chip e l e c t r o n i c s , i n c o r p o r a t e d multilayer ceramic chip capacitors method classification reflow soldering flow soldering selective reflow mass reflow ? ir/convection ? vps (vapor phase) ? hot air/gas ? laser dual wave gmc s eries
19 6-3. manual soldering manual soldering can pose a great risk of creating thermal cracks in chip capacitors. the hot soldering iron tip comes into direct contact with the end terminations, and operators carelessness may cause the tip of the soldering iron to come into direct contact with the ceramic body of the capacitor. therefore the soldering iron must be handled carefully, and close attention must be paid to the selection of the soldering iron tip and to temperature control of the tip. 6-4. amount of solder 6-5. cooling natural cooling using air is recommended. if the chips are dipped into solvent for cleaning, the temperature difference ( ? t) must be less than 100c. 6-6. cleaning if rosin flux is used, cleaning usually is unnecessary. when strongly activated flux is used, chlorine in the flux may dissolve into some types of cleaning fluids, thereby affecting the chip capacitors. this means that the cleaning fluid must be carefully selected, and should always be new. 7. notes for separating multiple, shared pc boards a multi-pc board is separated into many individual circuit boards after soldering has been completed. if the board is bent or distorted at the time of separation, cracks may occur in the chip capacitors. carefully choose a separation method that minimizes the bending of the circuit board. cal-chip e l e c t r o n i c s , i n c o r p o r a t e d multilayer ceramic chip capacitors too much solder amount of solder is adequate not enough solder cracks tend to occur due to large stress maximum amount of solder minimum amount of solder weak holding force may cause bad connections or detaching of the capacitor over 60 sec 10~20 sec over 60 sec reflow soldering over 60 sec 2~3 sec over 60 sec flow soldering gmc s eries
20 chip size 0402* 0603* 0805 1206 1210 1812* 1825* 2220 2225* 3640* l 0.021 0.035 0.040 0.040 0.040 0.050 0.050 0.050 0.050 0.060 w 0.022 0.030 0.050 0.065 0.100 0.120 0.250 0.250 0.250 0.400 s 0.017 0.030 0.040 0.080 0.080 0.130 0.130 0.130 0.170 0.300 t 0.059 0.100 0.120 0.160 0.160 0.230 0.230 0.230 0.270 0.420 recommended p ad dimensions cal-chip e l e c t r o n i c s , i n c o r p o r a t e d multilayer ceramic chip capacitors a pplication i nformation on s older p ad d esign for s urface m ount c hip c apacitor dimensions (inches) *these sizes are recommended for use with ir and vapor phase soldering only. no tice : specifications are subject to change without notice. contact your nearest cal-chip sales office for the latest specifications. all statements, information and data given herein are believed to be accurate and reliable, but are presented without guarantee , warranty, or responsibility of any kind, expressed or implied. statements or suggestions concerning possible use of our products are made without representation or warranty that any such use is free of patent infringement and are not recommendations to infring e any patent. the user should not assume that all safety measures are indicated or that other measures may not be required. specificati ons are typical and may not apply to all applications. gmc s eries


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